PD - Principal, Physical Design

Join the leading chiplet startup! As an Eliyan Principal Physical Design Engineer, you will be working at a fast-paced early-stage startup creating technologies that fuel tomorrow’s chiplet based systems with best-in-class power, area, manufacturability, and design flexibility. You will drive the development of cutting-edge ASICs from RTL to GDSII.  You will work with a cross-functional team of industry experts that operate from first principles, innovate, and push the envelope to create high-volume and high-performance manufacturable products. In this role, you will oversee and optimize the entire design flow, including synthesis, place-and-route (PnR), static timing analysis (STA), electromigration/IR drop analysis (EM/IR), and physical verification (PV). You will also focus on developing and improving design flows and methodologies to ensure high-quality, on-time delivery. We offer a fun work environment with excellent benefits. Responsibilities: • Architecture and packaging driven floorplanning and integration so physical partitions match system and package constraints • Well defined boundaries with lego style pin alignment and consistent interface placement across chip and blocks • Feedthrough, repeater and bus planning with early reservation of routing corridors, layers, and resources for cross block connectivity. • Define clocking architecture methodology selecting spine and rib, H tree, or mesh to optimize power, skew, latency, and robustness. • Establish CTS methodology including skew and latency targets, buffer and ICG strategy, NDR and shielding rules for critical clock routes. • Define skew groups and balancing strategy across library corners, ensuring consistent behavior under MMMC variations and derates. • Drive clock constraint quality across hierarchy with clean chip to block and block to chip handoff for signoff readiness. • Define DRC aware power grid architecture including rings, straps, and mesh, matching metal resistivity assumptions to IR drop targets and EM limits. • Ensure careful planning around analog routing with keepouts, shielding, spacing, and grid topology choices that preserve sensitive nets and meet DRC. • Drive lego aligned power mesh alignment across top level, subsystem, and block level with consistent strap pitch, via patterns, and clean connectivity. • Lead early and signoff EM and IR analysis, identify hotspots, and implement grid reinforcement and via optimization without routing or congestion penalties. • Align power planning with floorplan and package constraints including bump map, current demand, and entry points to minimize noise and IR drop. Qualifications: • 8 to 12 years ASIC physical design experience owning floorplanning integration clocking and power planning from early feasibility through signoff and tapeout on complex SoCs • Expert in architecture and package driven hierarchy planning with lego aligned boundaries pin strategy feedthrough repeater bus planning plus CTS methodologies including spine rib H tree or mesh • Strong EM IR PV and STA awareness with MMMC and library corner skew group balancing advanced node exposure TSMC 3nm 2nm or Samsung 2nm and functional ECO execution experience